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Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

:	Ulrich HP Fischer-Hirchert
:	Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
:	Springer-Verlag
:	9783642253768
:	1
:	CHF 104.10
:

:	Elektronik, Elektrotechnik, Nachrichtentechnik
:	English

:	336
:	Wasserzeichen/DRM
:	PC/MAC/eReader/Tablet
:	PDF

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.

	Preface	5
	Contents	7
	Abbreviations	13
	1 Introduction into Photonic Packaging	20
	Abstract	20
	1.1 Optical Transmission Systems	20
	1.2 System Applications of Optical Communications	23
	1.2.1 Optical Telecommunication Systems	23
	1.2.2 Optical Datacom Systems	27
	1.2.3 Optical Systems in Cars and In-house Areas	30
	1.3 Photonic Packaging and Interconnection Technology	34
	References	37
	2 Optical Waveguides	41
	Abstract	41
	2.1 The Most Important Optical Laws	41
	2.1.1 Homogeneous Plane Wave	42
	2.1.2 Phase and Group Velocity	44
	2.1.3 Reflection	44
	2.1.4 Refraction	45
	2.1.5 Total Reflection	46
	2.1.6 Numerical Aperture	47
	2.2 Optical Fiber Profiles	47
	2.2.1 Step Profile	49
	2.2.2 Monomode Glass Fibers	51
	2.2.3 Gradient profile	53
	2.2.4 Phase-space Diagrams: ({{\bf sin}^{\bf 2} {\Theta} \,{\bi and}\,{\bi r}^{\bf 2} } )	54
	2.3 Dispersion	55
	2.4 Attenuation	56
	2.5 Polymeric Fibers	58
	2.6 Optical Waveguides in InP, GaAs, PMMA, and SiO2	59
	2.6.1 Geometry of Integrated Waveguides	61
	2.6.2 Semiconductor Laser	62
	2.6.3 PMMA-integrated Waveguides	63
	2.7 SiO2-Optical Waveguides	65
	2.8 Production of Optical Fibers	66
	2.9 Gas Phase Methods	67
	2.9.1 Drawing of Glass Fibers	70
	2.9.2 Types of Fiber-Optic Cables	71
	References	72
	3 Optical Mode-field Adaptation	74
	Abstract	74
	3.1 Theory of Optical Mode-field Adaptation	75
	3.2 Definition of Field Radius	75
	3.3 Approximations to Determine the Mode-field Radius	81
	3.4 Loss Mechanisms in the Waveguide Coupling	83
	3.5 Coupling Efficiency in Case of Mode-field Mismatch	84
	3.6 Coupling Efficiency in the Presence of Longitudinal Displacement	87
	3.7 Coupling Efficiency in the Presence of Transverse Offset	89
	3.8 Coupling Efficiency in the Presence of Angular Misalignment	90
	References	92
	4 Fiber-Optical Coupling	94
	Abstract	94
	4.1 Adjusting Techniques	94
	4.1.1 Active Techniques	94
	4.1.2 Passive Techniques	95
	4.2 Fixation Techniques	97
	4.3 Characteristics of a Good Coupling	98
	4.4 Reflections	99
	4.5 Mode Fields in Waveguide Structures (Spot Size)	100
	4.6 Coupling Efficiencies	102
	4.7 Laser--Fiber Coupling	108
	4.8 Waveguide Taper	114
	4.9 Mode-Field Measurement Methods	114
	4.9.1 Near-Field Method	115
	4.9.2 Median-Field Method	117
	4.9.2.1 Automated Acquisition	120
	4.9.2.2 Measurement Setup	121
	4.9.2.3 Results	122
	4.9.3 Far-Field Method	124
	4.10 Summary	125
	References	125
	5 RF Lines	127
	Abstract	127
	5.1 Maxwell's Equations	127
	5.2 Wave Types	129
	5.3 Conduction Equations	131
	5.4 Skin Effect	133
	5.5 Coaxial Cables	134
	5.6 Wave Impedance	136
	5.7 Coplanar Lines	136
	5.8 Substrate Materials	138
	5.9 High-Frequency Connection of OEICs	140
	5.9.1 K-plug Connection	141
	5.9.2 RF Supply from the Plug to the OEIC	142
	5.10 Production of Coplanar Lines	143
	5.10.1 TMM Substrate	143
	5.10.2 Alumina Ceramic	145
	5.10.3 Silicon	146
	References	147
	6 Soldering, Adhesive Bonding, and Bonding	148
	Abstract	148
	6.1 Die Bonding	148
	6.2 Heat Sinks	149
	6.3 Failure Mechanisms	152
	6.4 Reliability Tests	153
	6.5 Adhesive Bonding	153
	6.6 Wire Bonding	154
	6.7 Thermo-compression Bonding	157
	6.8 Ultrasonic Bonding	159
	6.9 Thermo-sonic Bonding	160
	6.10 Bonding Tools	160
	References	162
	7 Optical Connection Technology	163
	Abstract	163
	7.1 Single-Fiber Connectors	163
	7.2 Multi-mode and Multi-fiber Connectors	165
	7.3 Examples of Optical Connectors	166
	7.4 Optical Fiber Tapers	171
	7.4.1 Manufacturing of Fiber Tapers	171
	7.4.2 Taper Measurement Setup	173
	7.4.3 Measurement of the Reference Light Source	175
	7.4.4 Measurement of the Reference Light Coupled to the Fiber	176
	References	179
	8 Active Adjustment Techniques	180
	Abstract	180
	8.1 Micrometer Positioners	180
	8.1.1 Mechanical Positioners	180
	8.2 Laser Microwelding	186
	8.2.1 Laser Welding Methods	186
	8.3 Criteria for the Choice of Welding Methods	187
	8.4 Laser Material Processing	188
	8.5 Industrial Multi-point Laser Welding	191
	8.6 Laser Micro-welding for Modules with Tapered Fibers	193
	8.6.1 Coupling Concept	193
	8.6.2 Module Setup	196
	8.6.3 Flange Setup	197
	8.6.4 Welding Results	198
	8.6.5 Initial Welding Results	199
	8.6.6 Correction After Initial Welding	202
	8.6.7 Dynamical Shift	204
	References	205
	9 Passive Adjustment Techniques	206
	Abstract	206
	9.1 Flip-Chip Technique	206