: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
: Packaging of High Power Semiconductor Lasers
: Springer-Verlag
: 9781461492634
: 1
: CHF 151.90
:
: Wärme-, Energie- und Kraftwerktechnik
: English
: 402
: Wasserzeichen/DRM
: PC/MAC/eReader/Tablet
: PDF
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics& Precision Mechanics, Chinese Academy of Sciences.