| Preface | 5 |
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| Contents | 8 |
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| Contributors | 10 |
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| Part I Robust Design | 14 |
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| Modeling and Design for Reliability of Analog Integrated Circuits in Nanometer CMOS Technologies | 16 |
| 1 Introduction | 16 |
| 2 Variability- and Reliability-Induced Analog Circuit Performance Degradation | 17 |
| 2.1 Variability and Mismatch | 17 |
| 2.2 Time-Dependent Degradation | 18 |
| 2.2.1 Time-Dependent Dielectric Breakdown | 19 |
| 2.2.2 Hot-Carrier Injection | 19 |
| 2.2.3 Negative Bias Temperature Instability | 19 |
| 3 Reliability Analysis of Analog Integrated Circuits | 20 |
| 3.1 Illustrative Circuit Example | 22 |
| 4 Circuit Techniques for Variability and Degradation Resilience | 24 |
| 4.1 Solutions to Processing Variability | 24 |
| 4.2 Solutions to Time-Dependent Degradation | 25 |
| 5 Conclusions | 28 |
| References | 28 |
| Modeling and Simulation of Statistical Variability in Nanometer CMOS Technologies | 30 |
| 2 Sources of Statistical Variability | 31 |
| 3 Statistical Variability in Advanced CMOS Devices | 32 |
| 4 Statistical Compact Model Strategy | 39 |
| 5 Impact of Statistical Variability on SRAM | 42 |
| 6 Conclusions | 44 |
| References | 45 |
| Advanced Physical Design in Nanoscale Analog CMOS | 47 |
| 2 Pre-Layout Simulation | 48 |
| 3 Post-Layout Simulation | 49 |
| 4 Process Variability | 50 |
| 5 Mitigating Local Mismatch Errors | 51 |
| 5.1 Quantum-Effect Mismatch Errors | 51 |
| 5.2 Stress-Induced Mismatch Factors | 52 |
| 5.3 High-Frequency Device Matching | 52 |
| 5.4 Strategy for Matching as Devices are Downscaled | 52 |
| 6 HF Analog Device Physical Design | 54 |
| 6.1 Restricting the Number of Gate Fingers (F) | 54 |
| 6.2 Device Optimum Current Density Ids/(W/L
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