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Advanced Materials for Thermal Management of Electronic Packaging

:	Xingcun Colin Tong Ph.D
:	Advanced Materials for Thermal Management of Electronic Packaging
:	Springer-Verlag
:	9781441977595
:	1
:	CHF 227.10
:

:	Elektronik, Elektrotechnik, Nachrichtentechnik
:	English

:	618
:	Wasserzeichen
:	PC/MAC/eReader/Tablet
:	PDF

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

	Advanced Materials for Thermal Management of Electronic Packaging	3
	Preface	7
	Contents	9
	Abbreviations	17
	Chapter 1: Thermal Management Fundamentals and Design Guides in Electronic Packaging	23
	Rationale of Thermal Management	23
	Heat Sources and Thermal Effects on Integrated Circuit Operation	25
	Power Density	25
	Joule Heating	26
	Thermal Failure Induced by Different Coefficient of Thermal Expansions	27
	Thermal Failure Rates	28
	Thermal Management Challenges and Common Concerns	28
	Overall Picture of Thermal Management in Different Packaging Levels	31
	Chip Level Packaging Thermal Management	33
	Board Level Packaging Thermal Management	34
	System-Level Packaging Thermal Management	37
	Thermal Management Solutions	38
	Hardware Solutions	39
	Software Solutions and Software-Based Dynamic Thermal Management	44
	Optimal Thermal Design of a Package	47
	Fundamentals of Heat Transfer and Thermal Calculation in Electronic Packaging	49
	Conduction	50
	Convection	53
	Radiation	54
	Multimode Heat Transfer in Electronic Packaging	56
	Microscale Heat Transfer	58
	Design for Advanced Thermal Management of Electronic Packaging	60
	Thermal Design Guidelines	61
	Thermal Modeling and Simulation	63
	Principles of Thermal Modeling	64
	General Approaches	65
	Example Methods for Thermal Modeling of Electronic Packaging	66
	Chip Modeling	67
	Substrate Modeling	67
	Interfaces	68
	Experimental Verification	68
	Materials Selection for Advanced Thermal Management	69
	Interface Joining Materials	70
	Bulk Materials for Heat Spreading and Dissipating	71
	Materials and Components Integration	72
	Higher Conductivity Materials	72
	Increasing Wetting or Bonding Forces	73
	Decreasing Interface Thickness	73
	Elimination of the Number of Interfaces	73
	Environmental Compliance of Thermal Management Materials	74
	RoHS	75
	WEEE	76
	Summary	77
	References	79
	Chapter 2: Characterization Methodologies of Thermal Management Materials	81
	Thermal Properties and Measurement Techniques	81
	Thermal Conductivity and Diffusivity	81
	Axial Flow Methods	85
	Absolute Axial Heat Flow	85
	Comparative Cut Bar (ASTM E1225 Test Method)	85
	Guarded or Unguarded Heat Flow Meter Method (ASTM C518, E1530 Test Methods)	86
	Guarded Hot Plate Method (ASTM C 177 Test Method)	86
	Hot Wire Method (ASTM C1113 Test Method)	87
	Laser Flash Method	88
	Coefficient of Thermal Expansion	90
	Specific Heat Capacity	91
	Thermal Shock Resistance	92
	Thermal Characterization of Micro/Nanomaterials	94
	The 3omega Method	95
	2-D Thin Films	95
	1-D Nanomaterials	99
	Thermoreflectance Approach	99
	Electrical Properties and Measurement Techniques	102
	Electrical Conductivity and Resistivity	102
	Eddy Current Testing	103
	Two-Point Technique	103
	Four-Point Technique	104
	Van der Pauw Technique	104
	Permittivity and Its Characterization	105
	Thermomechanical Characterization	106
	Characterization Techniques of Thermally Induced Stress and Strain	107
	Micromechanical Tester	108
	Moiré Interferometry	109
	Speckle Techniques	111
	Fundamental Equations of Deformable Bodies	112
	Constitutive Behavior	113
	Thermomechanical Analysis	116
	Plain Stress and Plain Strain	117
	Beams and Laminate Assemblies	117
	Bimaterial Assembly	118
	Trimaterial Assembly	121
	Numerical Method	121
	Thermomechanical Failures	122
	Static Failure	123
	Failure of Fracture Mechanics	123
	Fatigue Failure	124
	Analytical Techniques for Materials Characterization	126
	Optical Microscopy	126
	X-Ray Diffraction	128
	Single-Crystal Method	129
	Scanning Electron Microscopy	131
	Transmission Electron Microscopy	132
	Scanning Acoustic Microscopy	134
	Atomic Force Microscopy	136
	Contact Mode	137
	Lateral Force Microscopy	137
	Noncontact Mode	137
	Dynamic Force/Intermittant-Contact/``Tapping Mode´´ AFM	137
	Force Modulation	138
	Phase Imaging	138
	Surface Finish Requirement and Contact Interface Compatibility	139
	Corrosion and Oxidation Protection	139
	Noble Finish Selection	139
	Gold (Au)	140
	Palladium (Pd)	140
	Noble Metal Alloys	140
	Nonnoble Finishes	141
	Tin (Sn)	141
	Silver (Ag)	142
	Ni