| Voltage Regulators for Next Generation Microprocessors | 3 |
|---|
| Preface | 7 |
| Abstract | 11 |
| Contents | 13 |
| Abbreviations | 19 |
| Chapter 1: Introduction | 27 |
| 1.1 The Microprocessor Load | 27 |
| 1.2 The Microprocessor Power Supply | 35 |
| 1.2.1 Voltage Regulator (VR) Specifications | 35 |
| 1.2.1.1 VR Guidelines for Servers and Workstations | 38 |
| 1.2.1.2 VR Guidelines for Notebooks | 38 |
| 1.2.1.3 The DrMOS Specification | 39 |
| 1.2.2 Basic Circuit Topology | 39 |
| 1.2.3 System Architecture | 41 |
| 1.2.4 Semiconductor Power Devices | 43 |
| 1.2.4.1 Device Modeling and Optimization Tools | 47 |
| 1.2.5 Gate Driving Schemes | 48 |
| 1.2.6 Filters | 51 |
| 1.2.6.1 Input Filter | 52 |
| 1.2.6.2 Output Filter | 53 |
| 1.2.7 Control Systems | 57 |
| 1.2.7.1 Load Line Regulation | 58 |
| 1.2.7.2 Multiphase Regulation | 61 |
| 1.2.7.3 Multimode Switching Modulation | 63 |
| 1.2.7.4 Gate Driving Control | 63 |
| 1.2.8 Packaging and Integration | 65 |
| 1.2.9 Commercial Voltage Regulators | 67 |
| 1.2.10 Survey on Power MOSFET Models for Circuit Simulations | 71 |
| 1.3 Objectives of the Thesis | 74 |
| 1.4 Methodological Approach | 75 |
| 1.5 Thesis Outline | 79 |
| References | 80 |
| Chapter 2: Model Level 0: Switching Behavior of Power MOSFETs | 92 |
| 2.1 Power MOSFET Model for Circuit Simulations | 93 |
| 2.1.1 Model Structure and Implementation | 94 |
| 2.1.2 Model Data Acquisition | 100 |
| 2.1.2.1 Gate Resistance and Package Impedances | 100 |
| 2.1.2.2 DC Output Characteristics | 105 |
| 2.1.2.3 Interelectrode Capacitances | 107 |
| 2.1.2.4 Body Diode Reverse Recovery | 112 |
| 2.2 Switched Converter Test Board | 115 |
| 2.2.1 Gate Driver | 116 |
| 2.2.2 Input/Output Filters | 119 |
| 2.2.3 PCB Layout Impedance Characterization | 120 |
| 2.3 Switched Converter Simulation Setup | 122 |
| 2.4 Model Validation | 126 |
| 2.5 Analysis of Switching Behavior | 137 |
| 2.5.1 Loss Breakdown | 138 |
| 2.5.1.1 Switching Time Subintervals | 139 |
| CHS and RR at LE Transition (t1-t3) | 141 |
| VHS at LE Transition (t3-t4) | 142 |
| VHS at FE Transition (t5-t6) | 143 |
| CHS at FE Transition (t6-t7) | 143 |
| 2.5.1.2 Identification of Switching Loss Mechanisms | 143 |
| Load Current Hard-Switching (or Snubbed Hard-Switching SHS) | 143 |
| Half-Bridge Charging (Both Capacitive and Inductive) | 144 |
| Gate Charging | 144 |
| Reverse Recovery | 144 |
| Gate Bounce | 145 |
| Avalanche Breakdown | 145 |
| 2.5.1.3 Loss Quantification | 145 |
| 2.5.2 Influence of the Body-Effect on Switching Losses | 147 |
| 2.5.2.1 Impact on Reverse Recovery | 149 |
| 2.5.2.2 Impact on Gate Bounce | 151 |
| 2.5.3 Loss Analysis of a Multichip Module | 153 |
| References | 156 |
| Chapter 3: Model Level 1: Piecewise Linear Analytical Switching Model | 158 |
| 3.1 Modeling Approach | 159 |
| 3.2 Hard-Switching Model | 166 |
| 3.2.1 Leading Edge Transition | 168 |
| 3.2.2 Falling Edge Transition | 172 |
| 3.2.3 Leading and Falling Edge Transitions Tradeoffs | 175 |
| 3.3 Leading Edge Switched-Node Ringing | 180 |
| 3.3.1 Charging Loss | 184 |
| 3.3.2 Overvoltage Stress | 186 |
| 3.3.3 Avalanche Breakdown | 187 |
| 3.3.4 Reverse Recovery | 191 |
| 3.3.5 Gate Bounce | 194 |
| 3.4 Falling Edge Ringing Transition | 205 |
| 3.4.1 Charging Loss | 209 |
| 3.4.2 Overvoltage Stress | 213 |
| 3.4.3 Avalanche Breakdown | 215 |
| 3.5 Gate Driving | 215 |
| 3.6 Model Validation | 216 |
| References | 220 |
| Chapter 4: Model Level 2: Power Loss Model | 221 |
| 4.1 Power MOSFET Losses | 222 |
| 4.1.1 Half-Bridge Charging Loss | 222 |
| 4.1.2 Gate Charging Loss | 223 |
| 4.1.3 Load Current Hard-Switching | 225 |
| 4.1.3.1 LE Transition | 226 |
| 4.1.3.2 FE Transition | 227 |
| 4.1.4 Load Current ON Conduction | 229 |
| 4.2 Losses of Gate Drive Switches | 231 |
| 4.3 Filter Loss | 232 |
| 4.4 PCB Loss | 233 |
| 4.5 Model Validation | 234 |
| References | 236 |
| Chapter 5: Model Level 3: Optimization | 237 |
| 5.1 Output Filter | 237 |
| 5.1.1 Steady-State Output Ripple | 238 |
| 5.1.2 Load Line Transient | 241 |
| 5.1.2.1 Output Current Slew Rate | 243 |
| 5.1.2.2 Output Inductors´ Discharge | 244 |
| 5.1.3 Component Selection Procedure | 247 |
| 5.2 Input Filter | 250 |
| 5.3 Power MOSFETs and Gate Drivers | 252 |
| 5.3.1 Design Guidelines | 255 |
| 5.3.2 Optimization Case Example | 256 |
| 5.4 Selection of Fs, Lo, and Np | 259 |
| 5.4.1 Case-Example 1: State-of-the-Art Desktop Application | 259 |
| 5.4.2 Case Example 2: State-of-the-Art Laptop Application | 263 |
| References | 267 |
| Chapter 6: Roadmap Targets | 268 |
| 6.1 Power Switches | 269 |
| 6.1.1 State-of-the-Art Trench4 MOSFET Technology | 270 |
| 6.1.2 Trench6 MOSFET Technology | 276 |
| 6.1.3 Next Generation Technologies | 283 |
| 6.2 Gate Drivers | 286 |
| 6.3 Packaging | 289 |
| 6.4 Passive Filters | 289 |
| 6.5 Control | 291 |
| 6.6 Layout Arrangement | 292 |
| 6.7 Mobile Laptop Applications | 298 |
| References | 300 |
| Chapter 7: Conclusions and Future Work | 302 |
| Appendix A: Third Quadrant DC Output Character
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