: Guennadi A. Kouzaev
: Applications of Advanced Electromagnetics Components and Systems
: Springer-Verlag
: 9783642303104
: 1
: CHF 198.80
:
: Elektronik, Elektrotechnik, Nachrichtentechnik
: English
: 534
: Wasserzeichen/DRM
: PC/MAC/eReader/Tablet
: PDF

This text, directed to the microwave engineers and Master and PhD students, is on the use of electromagnetics to the development and design of advanced integrated components distinguished by their extended field of applications. The results of hundreds of authors scattered in numerous journals and conference proceedings are carefully reviewed and classed. 

Several chapters are to refresh the knowledge of readers in advanced electromagnetics. New techniques are represented by compact electromagnetic-quantum equations which can be used in modeling of microwave-quantum integrated circuits of future In addition, a topological method to the boundary value problem analysis is considered with the results and examples. 

One extended chapter is for the development and design of integrated components for extended bandwidth applications, and the technology and electromagnetic issues of silicon integrated transmission lines, transitions, filters, power dividers, directional couplers, etc are considered. Novel prospective interconnects based on different physical effects are reviewed as well. 

The ideas of topology is applicable to the electromagnetic signaling and computing, when the vector field maps can carry discrete information, and this area and the results in topological signaling obtained by different authors are analyzed, including the recently designed predicate logic processor operating spatially represented signal units. 

The book is rich of practical examples, illustrations, and references and useful for the specialists working at the edge of contemporary technology and electromagnetics.

Title1
Preface4
Acknowledgements6
Contents7
Abbreviations14
Basic Electromagnetics16
Scalars, Vectors, and Fields16
Electric Field19
Magnetic Field19
Dynamic Theory of the EM Field20
Time-harmonic EM Field Equations21
Wave Equations23
Plane TEM Wave24
Ray Representation of TEM Wave in Open Space27
Nonlinear Electromagnetism28
Macro Electromagnetism of Nonlinear Medium28
Dynamics of Charged Particles and Dipolar Molecules in EM Field30
Charged Particle in EM Field31
Dipolar Molecules in EM Field39
Boundary Value Problems of Electromagnetism46
Boundary Conditions for the Electric and Magnetic Fields46
Surface Impedance Boundary Conditions47
Boundary Value Problems49
Energy Conservation Law50
Reflection of TEM Waves from the Boundary of Two Magnetodielectrics52
References61
Theory of Waveguides65
Analytical Treatment of Waveguides65
Separation of the Variables Method67
Field Series Expansion Method70
Transverse Resonance Method and Analytical Treatment of Waveguides71
Analytical Models of TEM Transmission Lines75
Modeling of Quasi-TEM Modes of Transmission Lines78
Numerical Methods Used in the Waveguide Theory88
Finite Difference and Transmission Line Matrix Methods88
Integral Equations for Waveguides and Their Numerical Treatment90
Variational Functionals for Waveguides100
References102
Waveguide Discontinuities and Components108
A More Detailed Theory of Regular Waveguides for the Discontinuity Treatment108
Equivalent Transmission Line Approach and Microwave Networks111
EM Computational Methods for Waveguide Discontinuities114
Mode Matching Method to Calculate the Waveguide Junctions114
Integral Equation Method for Waveguide Joints116
Stationary Functionals and Equivalent Circuits of Discontinuities121
Microstrip Discontinuities and Their Parallel-plate Models123
Full-wave FDTD, TLM, FEM, and Integral Equation Treatment of Discontinuities128
References130
Geometro-topological Approaches to the EM Problems132
Topological Approach to the Theory of Boundary Value Problems134
Visualization and Topological Analysis of the EM Field Maps135
Field Maps of Harmonic Fields and Their Topological Analysis135
Maxwell Relationships of Topological Schemesof the Electric and Magnetic Harmonic Fields141
Boundary Conditions and the Field-force Lines145
Applications of the Topological Technique to the EM Boundary Value Problems146
Applications of the Topological Approach for the Modeling of Microwave Components164
Topological Analysis of the Time-dependent EM Field185
Topological Theory of the EM Field with the Differential Forms188
Topological Electromagnetism of Open-space Radiated Field190
References192
Technologies for Microwave and High-speed Electronics199
RF Printed Circuit Boards199
Microwave Hybrid ICs201
Ceramic Thick-film Technologies202
Microwave Three-dimensional Hybrid Integrated Circuits204
Gallium Arsenide Monolithic Integrated Circuit Technology209
Silicon Technologies for RF and Microwaves210
Micromachining Technologies215
RF Nanointegrations217
Packaging of Microwave and Millimeter-wave Microchips218
Packages for Millimeter-wave Integrations218
Interconnecting of Chips220
Motherbords and Materials222
On the Evolution of Microwave and Millimeter-wave Electronics225
References226
Transmission Lines and Their EM Models for the Extended Frequency Bandwidth Applications233
Microstrip Lines233
Thin-film Microstrip Lines233
Superstrated Thin-film Microstrip Line241
Two-layer Substrate Microstrip Transmission Line242
Si-microstrip Transmission Lines Shielded by Impedance Layers247
Three-dimensional Modifications of Microstrip Line249
Multilayered CPW for Monolithic Applications258
Quasistatic Model of Generalized CPW for Monolithic ICs258
Elevated CPWs for Increased Frequencies264
Coplanar Strip Line267
Three-dimensional Modifications of CPW269
Micromachined Rectangular-coaxial and Rectangular Waveguides277
Substrate Integrated Waveguides (SIW)282
Review on the SIWs, Simulation Methods and Main Results282
Modeling of Differential SIW286
EM Model of Fenced Strip Line291
Comparative Analysis of Integrated Transmission Lines293
Interconnects for Optoelectronics295
Optical Interconnects295
Plasmon-polariton Interconnects and Components296
On the EM Theory of Plasmon-polariton Interconnects and Components301
Prospective Interconnects302
References304
Inter-component Transitions for Ultra-bandwidth Integrations318
Planar Line Transitions320
Quasi-planar Transitions322
CPW-microstrip Transitions322
Microstrip-CPS Transitions324
CPW-CPS Transitions325
Interlayer Transitions for 3-D Integrations326
Silicon Via-holes and Transitions326
EM Interlayer Transitions329
Via-holes of Micro- and Millimeter-wave Motherboards333
Grounding Via-holes333
Cavity Model of Circular-pad Grounding Via-hole335
Eccentric Circular-pad Grounding Via-hole337
Modeling and Measurement Results for Grounding Via-holes340
Through-substrate Via-holes and Their Modeling343
References346
Integrated Filters and Power Distribution Circuits352
Monolithic Integrated Filters352
Power Dividers, Directional Couplers, and