| Title | 1 |
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| Preface | 4 |
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| Acknowledgements | 6 |
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| Contents | 7 |
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| Abbreviations | 14 |
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| Basic Electromagnetics | 16 |
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| Scalars, Vectors, and Fields | 16 |
| Electric Field | 19 |
| Magnetic Field | 19 |
| Dynamic Theory of the EM Field | 20 |
| Time-harmonic EM Field Equations | 21 |
| Wave Equations | 23 |
| Plane TEM Wave | 24 |
| Ray Representation of TEM Wave in Open Space | 27 |
| Nonlinear Electromagnetism | 28 |
| Macro Electromagnetism of Nonlinear Medium | 28 |
| Dynamics of Charged Particles and Dipolar Molecules in EM Field | 30 |
| Charged Particle in EM Field | 31 |
| Dipolar Molecules in EM Field | 39 |
| Boundary Value Problems of Electromagnetism | 46 |
| Boundary Conditions for the Electric and Magnetic Fields | 46 |
| Surface Impedance Boundary Conditions | 47 |
| Boundary Value Problems | 49 |
| Energy Conservation Law | 50 |
| Reflection of TEM Waves from the Boundary of Two Magnetodielectrics | 52 |
| References | 61 |
| Theory of Waveguides | 65 |
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| Analytical Treatment of Waveguides | 65 |
| Separation of the Variables Method | 67 |
| Field Series Expansion Method | 70 |
| Transverse Resonance Method and Analytical Treatment of Waveguides | 71 |
| Analytical Models of TEM Transmission Lines | 75 |
| Modeling of Quasi-TEM Modes of Transmission Lines | 78 |
| Numerical Methods Used in the Waveguide Theory | 88 |
| Finite Difference and Transmission Line Matrix Methods | 88 |
| Integral Equations for Waveguides and Their Numerical Treatment | 90 |
| Variational Functionals for Waveguides | 100 |
| References | 102 |
| Waveguide Discontinuities and Components | 108 |
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| A More Detailed Theory of Regular Waveguides for the Discontinuity Treatment | 108 |
| Equivalent Transmission Line Approach and Microwave Networks | 111 |
| EM Computational Methods for Waveguide Discontinuities | 114 |
| Mode Matching Method to Calculate the Waveguide Junctions | 114 |
| Integral Equation Method for Waveguide Joints | 116 |
| Stationary Functionals and Equivalent Circuits of Discontinuities | 121 |
| Microstrip Discontinuities and Their Parallel-plate Models | 123 |
| Full-wave FDTD, TLM, FEM, and Integral Equation Treatment of Discontinuities | 128 |
| References | 130 |
| Geometro-topological Approaches to the EM Problems | 132 |
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| Topological Approach to the Theory of Boundary Value Problems | 134 |
| Visualization and Topological Analysis of the EM Field Maps | 135 |
| Field Maps of Harmonic Fields and Their Topological Analysis | 135 |
| Maxwell Relationships of Topological Schemesof the Electric and Magnetic Harmonic Fields | 141 |
| Boundary Conditions and the Field-force Lines | 145 |
| Applications of the Topological Technique to the EM Boundary Value Problems | 146 |
| Applications of the Topological Approach for the Modeling of Microwave Components | 164 |
| Topological Analysis of the Time-dependent EM Field | 185 |
| Topological Theory of the EM Field with the Differential Forms | 188 |
| Topological Electromagnetism of Open-space Radiated Field | 190 |
| References | 192 |
| Technologies for Microwave and High-speed Electronics | 199 |
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| RF Printed Circuit Boards | 199 |
| Microwave Hybrid ICs | 201 |
| Ceramic Thick-film Technologies | 202 |
| Microwave Three-dimensional Hybrid Integrated Circuits | 204 |
| Gallium Arsenide Monolithic Integrated Circuit Technology | 209 |
| Silicon Technologies for RF and Microwaves | 210 |
| Micromachining Technologies | 215 |
| RF Nanointegrations | 217 |
| Packaging of Microwave and Millimeter-wave Microchips | 218 |
| Packages for Millimeter-wave Integrations | 218 |
| Interconnecting of Chips | 220 |
| Motherbords and Materials | 222 |
| On the Evolution of Microwave and Millimeter-wave Electronics | 225 |
| References | 226 |
| Transmission Lines and Their EM Models for the Extended Frequency Bandwidth Applications | 233 |
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| Microstrip Lines | 233 |
| Thin-film Microstrip Lines | 233 |
| Superstrated Thin-film Microstrip Line | 241 |
| Two-layer Substrate Microstrip Transmission Line | 242 |
| Si-microstrip Transmission Lines Shielded by Impedance Layers | 247 |
| Three-dimensional Modifications of Microstrip Line | 249 |
| Multilayered CPW for Monolithic Applications | 258 |
| Quasistatic Model of Generalized CPW for Monolithic ICs | 258 |
| Elevated CPWs for Increased Frequencies | 264 |
| Coplanar Strip Line | 267 |
| Three-dimensional Modifications of CPW | 269 |
| Micromachined Rectangular-coaxial and Rectangular Waveguides | 277 |
| Substrate Integrated Waveguides (SIW) | 282 |
| Review on the SIWs, Simulation Methods and Main Results | 282 |
| Modeling of Differential SIW | 286 |
| EM Model of Fenced Strip Line | 291 |
| Comparative Analysis of Integrated Transmission Lines | 293 |
| Interconnects for Optoelectronics | 295 |
| Optical Interconnects | 295 |
| Plasmon-polariton Interconnects and Components | 296 |
| On the EM Theory of Plasmon-polariton Interconnects and Components | 301 |
| Prospective Interconnects | 302 |
| References | 304 |
| Inter-component Transitions for Ultra-bandwidth Integrations | 318 |
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| Planar Line Transitions | 320 |
| Quasi-planar Transitions | 322 |
| CPW-microstrip Transitions | 322 |
| Microstrip-CPS Transitions | 324 |
| CPW-CPS Transitions | 325 |
| Interlayer Transitions for 3-D Integrations | 326 |
| Silicon Via-holes and Transitions | 326 |
| EM Interlayer Transitions | 329 |
| Via-holes of Micro- and Millimeter-wave Motherboards | 333 |
| Grounding Via-holes | 333 |
| Cavity Model of Circular-pad Grounding Via-hole | 335 |
| Eccentric Circular-pad Grounding Via-hole | 337 |
| Modeling and Measurement Results for Grounding Via-holes | 340 |
| Through-substrate Via-holes and Their Modeling | 343 |
| References | 346 |
| Integrated Filters and Power Distribution Circuits | 352 |
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| Monolithic Integrated Filters | 352 |
| Power Dividers, Directional Couplers, and
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