: James C.M. Li, Fuqian Yang
: Fuqian Yang, James C.M. Li
: Micro and Nano Mechanical Testing of Materials and Devices
: Springer-Verlag
: 9780387787015
: 1
: CHF 141.10
:
: Sonstiges
: English
: 387
: Wasserzeichen/DRM
: PC/MAC/eReader/Tablet
: PDF

Nanoscale and nanostructured materials have exhibited different physical properties from the corresponding macroscopic coarse-grained materials due to the size confinement. As a result, there is a need for new techniques to probe the mechanical behavior of advanced materials on the small scales.Micro and Nano Mechanical Testing of Materials and Devices presents the latest advances in the techniques of mechanical testing on the micro- and nanoscales, which are necessary for characterizing the mechanical properties of low-dimensional materials and structures.

Written by a group of internationally recognized authors, this book covers topics such as:

  • Tech iques for micro- and nano- mechanical characterization;
  • P>
  • Size effects in the indentation plasticity;
  • haracterization of smart materials, including piezoelectric materials and shape memory alloys;
  • Ana ysis and modeling of the deformation of carbon-nanotubes.

Micro and Nano Mechanical Testing of Materials and Devices is a valuable resource for engineers and researchers working in the area of mechanical characterization of advanced materials.

Foreword5
Contents8
Contributors10
Principles and Applications of Indentation13
Size Effects in Nanoindentation60
Indentation in Shape Memory Alloys81
Adhesive Contact of Solid Surfaces97
Nanomechanical Characterization of One- Dimensional Nanostructures114
Deformation Behavior of Nanoporous Metals130
Residual Stress Determination Using Nanoindentation Technique148
Piezoelectric Response in the Contact Deformation of Piezoelectric Materials163
Mechanics of Carbon Nanotubes and Their Composites186
Microbridge Tests221
Nanoscale Testing of One-Dimensional Nanostructures292
Metrologies for Mechanical Response of Micro- and Nanoscale Systems317
Mechanical Characterization of Low- Dimensional Structures Through On- Chip Tests353
Index388